• AngelTech Virtual Live II
    2 NOVEMBER 2020

    Main Event: 2 November 2020 - 10am GMT (Greenwich Mean Time)

    China Recorded Event: 4 November 2020 - 10am CTT (China Taiwan Time)

    Pacific Recorded Event: 6 November 2020 - 10am PST (Pacific Standard Time)

AngelTech Virtual Live II

Following on from the successful launch of the virtual AngelTech Online Summit in May 2020, we are delighted to announce AngelTech Live II, taking place on 2 November 2020. AngelTech will once again consist of our established events of CS International and PIC International. This is not a replacement for the in-person events (we believe live face to face interaction, learning and networking can never be fully replaced digitally), it is designed to be complementary to it - to bring the industry together virtually and online to help deal with the unprecedented challenges we all currently face.

The 2nd virtual summit will utilise an enhanced event engine, integrating presentations, digital sponsors booths and the networking tools into one portal – allowing for live chat between delegates, speakers and sponsors.

Innovation is in AngelTech’s DNA and we are leveraging this strength to bring you an immersive and inspiring online event without the risk of travel during this uncertain period.

The event will take the form of three interactive sessions over 1 day and will be a must attend live summit consisting of:

  • Analyst talks
  • Industrial research
  • End user presentations

Key elements of the online summit:

  • Covering key topics of the industries
  • 3 interactive sessions over 1 day of analyst, industrial research and end user talks
  • 15 minute presentations – learn from experts in the industry
  • Recorded product demos
  • Live audience questions
  • Enhanced discussion and audience interaction
  • Video panel sessions
  • Sponsors digital booth (intro video, company content, lead generator)
  • After the live event, monthly keynotes to drive traffic to the event 24/7, 365

Innovation is in AngelTech’s DNA and we are leveraging this strength to bring you an immersive and inspiring online event without the risk of travel during this uncertain period.

BECOME AN EVENT PARTNER REGISTER TO ATTEND

Company/Products Breakout

If you are a company who is interested to reach the compound semiconductor and integrated photonics industries, if you partner with the event you will get to present to our 1,000+ audience in this breakout dedicated to showcase the very best companies and products offering solutions for the industry.

Expert analysis driving market dynamics and shaping the industries of tomorrow

While we are not the true heroes of this era, there is no doubt that our work is still of great importance. Governments decree that our fabs stay open, churning out the LEDs, lasers, sensors, amplifiers, photonic integrated circuits and power electronics that our societies depend upon.

All these classes of device will be discussed at this year’s AngelTech LIVE II, where we shall consider some of the most promising chip technologies under development. This one day, meeting offers a strong programme of presentations delivered by leading analysts and researchers.

The Sessions

Thanks to the great diversity of the compound semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.

2020 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.

We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.

We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper. Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.

Photonics integration will become the future engine many of our products in the next decade

The drive to miniaturization, battery power, high speed, sensing, imaging, and advanced computational processing means that photonic integration will grow, and grow quickly. Cramming discrete, individual components in a small box is going away, in fact, just like lots of transistors in an IC. Integration is key, and with photonics, there are a number of engineering challenges that need to be addressed that range from efficiently working with light, to driving high speed data with very low power consumption.

This years Angeltech LIVE II is the place to be to make sure you are calibrated and knowledgable in the latest work, advancements, and designs in the field of PICs - photonic integrated circuits. This one day meeting offers an incredible programme of presentation delivered by leading analysts and researchers.

The Sessions

While PIC based photonic integration technologies have grown on the back of optical communications, fiber optics, telecommunications, data communications even datacenters and high performance computing, this is only the beginning.

There are now many applications for PICs that go beyond just sending data quickly, with low power, and high integrity: These LIVE II sessions will gather indepth analysis of new growing arenas such as AI, automotive/LIDAR, sensing, bio-medical, industrial, consumer and many others. The expectation is that these new arenas will grow very quickly as they also require miniaturization, low power, high speeds, and of course batter power for portability.

From a technology standpoint, photonics integration has fostered incumbent technologies such as Indium Phosphide and Silicon Photonics, but as the demands on these technologies grow in terms of performance, we are now seeing GaAs take a role with integrated laser arrays for structured light sensing, LIDAR etc. We are also seeing new materials grow in interest such as glass, EO polymers, plasmonics, dielectric materials such as SiN being utilized in exciting new applications.

Agenda

Monday 2nd November 2020 starting at 10:00 GMT
10:00 CHAIRS OPENING REMARKS & INSTRUCTIONS - Chris Meadows, Head of Open Innovation, IQE, Michael Lebby, CEO Lightwave Logic, Jose Pozo, Director of Technology & Innovation, EPIC
10:05 Future, challenges and supply chain for the photonic circuit sector
Presented by Ana Gonzalez - EPIC
10:25 Quantum dot laser for supercomputers
Presented by Geza Kurczweil - Hewlett Packard Enterprise
10:45 Market interest continues for Silicon Photonics
Presented by Eric Mounier - Yole Développement
11:05 The Market Opportunity for Photonics
Presented by Eric Higham - Strategy Analytics
11:25 COFFEE BREAK
11:45 The Past, Present and Future for GaAs and GaN in RF Applications
Presented by Eric Higham - Strategy Analytics
12:05 Delivering a new era for solid-state lighting with cubic GaN
Presented by David Wallis - Kubos Semiconductors
12:25 Microfluidics for microLED displays
Presented by Paul Schuele - eLux display
12:45 A new material: producing aluminium scandium nitride via MOCVD
Presented by Stefano Leone - Fraunhofer IAF
13:05 A New Generation of High-Power LEDs for Digital Projection Systems
Presented by Benjamin Schulz - OSRAM Opto Semiconductors
13:25 COFFEE BREAK
13:45 Photonics Engineering for Quantum Sensors for High Grade Battery Manufacturing
Presented by Ali Anjomshoaa - Compound Semiconductor Centre
14:05 Recent Advances in Decade Bandwidth High Power MMIC Amplifiers
Presented by Michael Roberg - Qorvo
14:25 200mm/8-inch GaN power device and GaN-IC technology to unleash your power IC technology
Presented by Denis Marcon - imec
14:50 A novel design propels UV LED efficiency to a new high
Presented by Haiding Sun - University of Science & Technology of China
15:10 Sensing & Security: A compound semiconductor driven megatrend
Presented by Mark Furlong - IQE
15:30 COFFEE BREAK
15:50 UV Technology: 143 years and counting
Presented by Oliver Lawal - International Ultraviolet Association (IUVA).
16:10 5G’s Impact On Compound Semiconductor Industry
Presented by Ahmed Ben Slimane - Yole Développement
16:30 Emerging applications for UV LEDs
Presented by Jennifer Pagan - Aquisense Technologies
16:50 Pioneering gallium oxide at the AFRL
Presented by Andrew Green - Air Force Research Laboratory
17:10 CHAIR - CLOSING REMARKS
Presentation times and order are subject to change. This agenda was last updated on 14 Jan 2021 at 11:33am.
Monday 2nd November 2020 starting at 10:00 GMT
10:00 CHAIR OPENING REMARKS & INSTRUCTIONS - Michael Lebby, CEO, Lightwave Logic, Chris Meadows, Director, Open Innovation, IQE, Jose Pozo, Director of Technology & Innovation, EPIC
10:05 Future, challenges and supply chain for the photonic circuit sector
Presented by Ana Gonzalez - EPIC
10:25 Quantum dot laser for supercomputers
Presented by Geza Kurczweil - Hewlett Packard Enterprise
10:45 Market interest continues for Silicon Photonics
Presented by Eric Mounier - Yole Développement
11:05 The Market Opportunity for Photonics
Presented by Eric Higham - Strategy Analytics
11:25 COFFEE BREAK
11:45 Platform to PIC : first step toward chip-scale LiDAR
Presented by Dongjae Shin - Samsung
12:05 New technology options for high-speed modulators in Silicon Photonics – ePIXfab
Presented by Abdul Rahim - ePIXfab
12:25 Adapting IC Yield Management for Reliable PIC Devices
Presented by Vincent Zeng - Facebook
12:45 Innovative sensing with integrated photonics
Presented by Sergio Nicoletti - CEA-Leti
13:05 Co-design of electronics and photonics components for Silicon Photonics transceiver
Presented by Li Ke - CORNERSTONE
13:25 COFFEE BREAK
13:45 Opportunities of integrated optics in neuromorphic computing
Presented by Bert Offrein - IBM
14:05 Adoption of Silicon Photonics in reaching an inflection point
Presented by Vlad Kozlov - Lightcounting
14:25 Next level in controlling light in PICs
Presented by Stefan Abel - Lumiphase
14:45 The Promise of Co-Packaged Optics: Paving the Way for Improved Power, Size, and Cost
Presented by Robert Blum - Intel
15:05 Photonic integrated circuits: a game-changer for automotive lidar?
Presented by Amin Abbasi - imec
15:30 Plasmonics in CMOS foundries: a new toolkit for PICs,
Presented by Nikos Pleros - Aristotle University of Thessaloniki
15:50 Optical devices and industry roadmaps
Presented by Michael Lebby - Lightwave Logic Inc
16:10
Presentation times and order are subject to change. This agenda was last updated on 14 Jan 2021 at 11:33am.
Monday 2nd November 2020 starting at 11:45 GMT
11:45 PARTNER BREAKOUT SESSION
11:45 Hybrid PIC based modules enabling new applications from 5G to Covid-19 sensing
Presented by Arne Leinse - LioniX International
12:06 Software integration for supporting PIC design
Presented by Cem Bonfil - Optiwave
12:22 The future of Germanium: Breakthrough Opportunities
Presented by Pieter Arickx - Umicore
12:29 Two Paths to Economic Packaging & Test
Presented by Scott Jordan - Physik Instrumente
12:45 Customer-specific VCSELs and VCSEL arrays technology development
Presented by Marcin Gębski - VIGO System
13:04 Recent trends in LED and LASER diode device material characterization
Presented by Yves Lacroix - YSystems Ltd
13:19 Systems & Applications - Compound Semiconductor Devices and Photonic Integrated Circuits
Presented by Brian Stickney - C & D Semiconductor
13:36 Bridging the Gap between Electronic and Photonic Design
Presented by André Richter - VPIphotonics
13:50 High Volume Solutions for Compound Semiconductor Photonics
Presented by Ajit Paranjpe - Veeco
14:05 Build Momentum in your Photonics Design Flow
Presented by Pierre Wahl - Luceda Photonics
14:21 Thick Si-Photonic Technology Platform for Myriad Applications
Presented by Srivathsa Bhat - VTT Technical Research Centre of Finland
14:37 Hybrid PIC based modules enabling new applications from 5G to Covid-19 sensing
Presented by Arne Leinse - LioniX International
14:59 Software integration for supporting PIC design
Presented by Cem Bonfil - Optiwave
15:14 The future of Germanium: Breakthrough Opportunities
Presented by Pieter Arickx - Umicore
15:22 Two Paths to Economic Packaging & Test
Presented by Scott Jordan - Physik Instrumente
15:38 Customer-specific VCSELs and VCSEL arrays technology development
Presented by Marcin Gębski - VIGO System
15:57 Recent trends in LED and LASER diode device material characterization
Presented by Yves Lacroix - YSystems Ltd
16:12 Systems & Applications - Compound Semiconductor Devices and Photonic Integrated Circuits
Presented by Brian Stickney - C & D Semiconductor
16:29 Bridging the Gap between Electronic and Photonic Design
Presented by André Richter - VPIphotonics
16:43 High Volume Solutions for Compound Semiconductor Photonics
Presented by Ajit Paranjpe - Veeco
16:58 Build Momentum in your Photonics Design Flow
Presented by Pierre Wahl - Luceda Photonics
17:14 Thick Si-Photonic Technology Platform for Myriad Applications
Presented by Srivathsa Bhat - VTT Technical Research Centre of Finland

Partners

Become an Event Partner

All sponsors will get a presentation opportunity in a dedicated breakout room which will be promoted to our database and also on-demand post event.
Acquire GDPR-compliant leads for the event before, during and on-demand. Our AngelTech Online Summit debut in June attracted 900+ delegates and 900+ potential leads for sponsors to connect and engage with. The list is provided in advance to sponsors and is updated as and when new registrations come in.

Our AngelTech LIVE debut in June attracted 900+ delegates and 900+ potential leads for sponsors to connect and engage with. The list is provided in advance to sponsors and is updated as and when new registrations come in.
Seamlessly interact with delegates through live chat, email, the enhanced networking portal and much more!
As the event is hosted on demand for 3 months, you can continually grow your leads after the live show.
We will facilitate a 10 Zoom minute video interview between one of our respected Editors and the sponsor. This will be sent to our 60,000+ worldwide database via email before the event and once after the event. This alone would normally cost £2,500!
Showcase a variety of marketing materials, from videos and product demos to technical documents and twitter feeds. Attendees can chat to you via our easy-to-use live chat interface. Keeping track of your visitors is easy with our advanced reports, which can be generated at any time on-demand. See who’s been visiting your booth, and target those who watch or click on specific assets.
Full screen sponsor adverts will appear thanking sponsors during breaks, and for intermissions, rotating between all sponsors.